Team Xtreem PC3 19200 DDR3 2400

  • Team P/N:TXD34G2400HC9NDC01 2GBx2
    TXD34G2400HC11DC01 2GBx2
    TXD38G2400HC9NQC01 2GBx4
    TXD38G2400HC11QC01 2GBx4
    TXD38G2400HC11DC01 4GBx2
    TXD38G2400HC9NDC01 4GBx2
    TXD316G2400HC9NQC01 4GBx4
    TXD316G2400HC11QC01 4GBx4
    TXD316G2400HC10QDC01 8GBx2
    TXD332G2400HC10QQC01 8GBx4
    TXD364G2400HC10QQCF01 8GBx8
    TXD38G2400HC10QDC01 4GBx2
    TXD316G2400HC10QDCF01 4GBx4
  • Capacity: 4GBx2, 4GBx4, 2GBx2, 2GBx4, 4GBx2, 4GBx4, 8GBx2, 8GBx4
  • Info:Team Xtreem LV is the most popular overclocking and gaming gear in the LAN party. Based on the memory architecture evolution on Intel Core i7, Team raises the frequency of the Xtreem LV DDR3 by 20% from 2000MHz to 2400MHz. Also, by continuing the high frequency and low latency tradition of the Xtreem LV memory, the Xtreem LV DDR3 2400 can fully display the configuration 9-11-11-28 (tCL-tRCD-tRP-tRAS) at a low operating voltage at 1.65V without sacrificing either performance or stability. All these have witnessed the extraordinary R&D capacity and capability of Team. In addition to the unchanged genuine chip policy, Team ensures chip quality with the exclusive sorting technology to screen chips. In order to further ensure the optimal performance and flawless quality of the Xtreem LV DDR3 2400, Team applies the 24-hour burn-in test and industry-approved MemTest software to perform the OQC inspection of all modules before shipping to assure the stability and exceptional performance of every Xtreem LV DDR3 2400. The Xtreem LV DDR3 2400 from Team has a conventional 8-layered PCB design and is covered with the X-mark heat-sink labeled for the Xtreem series. In addition to the clean appearance as found in all Team Xtreem memory modules, a groove has been added to the heat-sink for power users to install fans on top to enhance ventilation. For more information on this product, please visit the Team Group website at: